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Leakage Current Analysis On PCB
Applications
Dec 03,2025
System introduction
The HJK-CBFA is an infrared detector for circuit fault analysis. It covers a variety of practical operating modes to meet diverse needs in circuit board testing. It can perform fault IC detection and localization on circuit boards, as well as display leakage current and heat level. It is capable of presenting and analyzing the temperature field distribution of circuit boards, and can also generate 3D thermal images to intuitively show heating ICs. The detector supports temperature field comparison between two boards to facilitate rapid fault diagnosis. Additionally, it features power-on current waveform detection and real-time temperature curve recording functions. Test results can be saved at any time, and a universal interface enables easy data export. The leakage current detection accuracy is ≤500 μA, and the leakage localization accuracy reaches 200 μm. The temperature measurement range is 0–150°C, and the maximum detection area is 200 mm × 150 mm.
product image
Product features
1. Circuit board fault IC detection and location;
2. Leakage current and heating level display for rapid heat source location;
3. Circuit board temperature field distribution display and analysis;
4. Dual-board temperature field comparison for rapid fault diagnosis;
5.Dual-light fusion for precise fault component location;
6. Power-on current waveform detection;
7. Circuit board 3D thermal image for intuitive display of heating ICs;
8. High-stability infrared detector;
9. Rigorous reliability design and verification;
10. Anti-static design;
11. Overcurrent protection design.
Application
Its temperature measurement range is 0~150°C.
It features multiple operating modes and can be used for circuit board fault detection and location, leakage current detection, dual-board comparison for fault diagnosis, temperature field analysis, circuit analysis, and more.
Equipment value
1. Based on the lock-in detection principle, it provides a powerful non-contact solution for circuit and IC failure analysis. It can effectively analyze temperature distribution, energy dissipation, micro-leakage current, and soldering issues, offering an improvement in detection sensitivity of more than two orders of magnitude compared to traditional thermal imaging analysis.
2. It features high-resolution infrared imaging, enabling the detection of subtle temperature differences.
3. With its advantages of high resolution and ultra-high sensitivity, it helps solve the difficulty of locating weak leakage faults in circuit failures.
Case
infrared thermal image of circuit failure analysis and repair
infrared video of circuit failure analysis and repair
Related Products
The HJK-Macro is a kind of thermal camera with a minimum resolvable size of 6μm, enabling the detection of the finest details on circuit boards, such as overheating or cold solder joints on pads, micro-solder joints, and fine wires of 6μm and above. It can capture temperature rises instantly and output clear images because of Cimage technology. The playback function supports further analysis of the entire process.
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Contact Us
Email: steven@hjkir.com
Call Us: +86-153-7751-9674
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